1. 2. 3. material content data sheet sales product name spb80p06p g issued 28. august 2013 ma# MA000723228 package pg-to263-3-2 weight* 1466.43 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 11.978 0.82 0.82 8168 8168 leadframe non noble metal iron 7439-89-6 0.853 0.06 582 inorganic material phosphorus 7723-14-0 0.256 0.02 174 non noble metal copper 7440-50-8 851.691 58.06 58.14 580791 581547 wire non noble metal aluminium 7429-90-5 3.745 0.26 0.26 2554 2554 encapsulation organic material carbon black 1333-86-4 8.732 0.60 5955 plastics epoxy resin - 96.056 6.55 65503 inorganic material silicondioxide 60676-86-0 477.370 32.55 39.70 325532 396990 leadfinish non noble metal tin 7440-31-5 9.657 0.66 0.66 6585 6585 plating non noble metal nickel 7440-02-0 0.228 0.02 156 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 156 solder non noble metal tin 7440-31-5 0.117 0.01 80 noble metal silver 7440-22-4 0.147 0.01 100 non noble metal lead 7439-92-1 5.602 0.38 0.40 3820 4000 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
